Global IC Chip Recycling

What We Recycle

TI and ADI analog/power, ST, NXP, Microchip and Renesas MCUs, Infineon power devices and AMD/Xilinx FPGAs. Review other ICs by actual ordering code and condition.

Category A

IC Chips

All types of integrated circuits — from legacy to cutting-edge

CPU

CPU — Central Processors

Desktop, server, and mobile CPUs from Intel, AMD, ARM, MIPS, RISC-V and more

Intel · AMD · Qualcomm · HiSilicon
GPU

GPU — Graphics Processors

Gaming, workstation, AI inference, and crypto mining GPUs

NVIDIA · AMD · Intel Arc · Apple GPU
MCU

MCU — Microcontrollers

8-bit, 16-bit, 32-bit MCUs for embedded, IoT, and industrial applications

STM32 · PIC · AVR · NXP · Renesas
FPGA

FPGA — Programmable Logic

All FPGA families for prototyping, production, and defense applications

Xilinx · Altera · Lattice · Microsemi
DSP

DSP — Signal Processors

Audio, video, communications and radar DSP chips

TI TMS320 · ADI SHARC · Freescale
ASIC

ASIC — Custom ICs

Networking ASICs, crypto mining chips, and application-specific designs

Broadcom · Marvell · Bitmain · Custom
Category B

Memory Chips

All memory technologies from consumer to industrial grade

DRAM

DRAM — Dynamic RAM

DDR3, DDR4, DDR5 SDRAM modules and bare dies for PC, server, and mobile

Samsung · Micron · SK Hynix · Nanya
SRAM

SRAM — Static RAM

High-speed SRAM for cache, networking, and real-time processing

ISSI · GSI · IDT · Cypress · Alliance
NAND

NAND Flash

SLC, MLC, TLC, 3D NAND for SSDs, embedded storage, and industrial use

Toshiba · WD · Samsung · Micron · Kioxia
NOR Flash

NOR Flash

Serial and parallel NOR Flash for code storage, MCU boot, and IoT devices

Winbond · Macronix · ISSI · GigaDevice
EEPROM

EEPROM

Serial EEPROM, I²C, SPI for configuration and calibration data storage

Atmel · Microchip · ST · Rohm
eMMC

eMMC / eMCP

Embedded MMC and Multi-Chip Package for mobile, tablet, and IoT devices

Samsung · Toshiba · Kingston · Hynix

Separate lots by condition

Unused and loose stock

Unused parts may not be in sealed original packaging. Record packaging integrity, opening history, retained labels and available storage information.

Obsolete parts and older lots

Obsolescence describes lifecycle; an older date code describes production timing. Neither alone establishes function, authenticity or value. Include full part numbers and demand context.

Removed, damaged and scrap parts

List removed, reworked, corroded or unidentified items separately. Confirm acceptance, test feasibility and handling options before mixing or shipping them.

Category C

Semiconductors & Components

Power, sensing, RF, and passive components from all major manufacturers

Power ICs

Power Management ICs

PMICs, DC/DC converters, LDO regulators, MOSFETs, gate drivers

TI · Infineon · ON Semi · Analog Devices
Sensors

Sensors & MEMS

Temperature, pressure, IMU, image sensors, ToF, and environmental sensors

Bosch · STMicro · Honeywell · ams OSRAM
RF Wireless

RF & Wireless ICs

WiFi, Bluetooth, LoRa, GNSS, Zigbee, UWB, and cellular modules

Semtech · Nordic · Murata · Skyworks
Connectors

Connectors

Board-to-board, FPC, USB, HDMI, RF connectors and wire harnesses

Molex · TE · Amphenol · JAE · Hirose
Passive Components

Passive Components

SMD resistors, capacitors (MLCC), inductors, transformers, crystals

TDK · Murata · Yageo · Vishay · KEMET
Interface ICs

Interface & Logic ICs

USB, PCIe, Ethernet PHY, CAN, RS-485, level shifters, logic gates

TI · MaxLinear · FTDI · Microchip
Category D

Industrial & Automotive

High-reliability components for mission-critical applications

Automotive ICs

Automotive ICs

AEC-Q100/Q101 qualified chips for ADAS, powertrain, body control, and infotainment

Infineon · NXP · Renesas · STMicro · TI
Industrial MCUs

Industrial MCUs

Extended temp range MCUs for factory automation, robotics, and energy management

STM32 · PIC · RX · RL78 · Cortex-M
Motor Drivers

Motor Drivers

BLDC, stepper, servo motor driver ICs for industrial and robotics applications

TI DRV · Allegro · ON Semi · ST L298
Industrial Ethernet

Industrial Ethernet

EtherCAT, PROFINET, Modbus, industrial Ethernet PHY and switch chips

Realtek · Microchip KSZ · TI DP83 · NXP
Isolation

Isolation Components

Optocouplers, digital isolators, isolated gate drivers for power electronics

Silicon Labs · TI ISO · Infineon · Broadcom
Hi-Rel

High-Reliability ICs

MIL-SPEC, aerospace, medical grade ICs for defense and critical systems

Microsemi · Aeroflex · Analog Devices · TI

We Accept All Major Brands

Brands describe inquiry categories and do not imply authorized distribution, live stock or guaranteed acceptance.

Texas Instruments Logo
Analog Devices Logo
AMD Logo
Diodes Incorporated Logo
Nexperia Logo
Renesas Logo
Microchip Logo
Omron Logo
Texas Instruments Logo
Analog Devices Logo
AMD Logo
Diodes Incorporated Logo
Nexperia Logo
Renesas Logo
Microchip Logo
Omron Logo
Texas Instruments Logo
Analog Devices Logo
AMD Logo
Diodes Incorporated Logo
Nexperia Logo
Renesas Logo
Microchip Logo
Omron Logo
Panasonic Logo
STMicroelectronics Logo
Infineon Logo
Toshiba Logo
Micron Logo
NXP Logo
ON Semiconductor Logo
Winbond Logo
Panasonic Logo
STMicroelectronics Logo
Infineon Logo
Toshiba Logo
Micron Logo
NXP Logo
ON Semiconductor Logo
Winbond Logo
Panasonic Logo
STMicroelectronics Logo
Infineon Logo
Toshiba Logo
Micron Logo
NXP Logo
ON Semiconductor Logo
Winbond Logo

Brand and part-number checks

How should brand and family be listed?

Name the manufacturer, such as TI, ADI, ST, NXP, Infineon, Microchip, Renesas or AMD/Xilinx, and retain the complete ordering code. Group MCU, analog, power, interface and FPGA items. Memory and other ICs can also be submitted with actual stock details.

AMD / Xilinx / Intel FPGA

Parts in one FPGA family can differ by capacity, speed grade, package and temperature grade. Retain the full ordering suffix in the inventory list.

Micron / Samsung / SK hynix

List DRAM, NAND, eMMC and UFS separately with full part number, density, package and lot. Components, modules and complete systems require different assessments.

Ready to Sell Your Components?

Submit part numbers, counts, condition and source records to confirm quotation and transaction terms.