MSL, Dry Packs and Date Codes: Reading Semiconductor Storage Records

A date code, storage shelf life and floor life after opening describe different information. Assess IC stock using its MSL, seal condition, opening history and actual storage conditions together.

Keep three time-related concepts separate

• Date code: manufacturer date or lot-identification information; confirm its meaning using that manufacturer’s rules.
• Storage shelf life: depends on packaging, materials and storage after delivery rather than the manufacturing date alone.
• Floor life: for applicable moisture-sensitive devices, the permitted environmental exposure after opening a dry pack and before reflow.

Read MSL together with its environmental conditions

TI application report SPRABY1A relates MSL to exposure time after opening. Its table gives 168 hours for MSL 3 at 30°C and 60% relative humidity. This does not mean that every opened chip can remain exposed for seven days. Confirm the device classification, pack label and actual exposure conditions.

The bag, desiccant and humidity card have different roles

A moisture-barrier bag, or MBB, provides the packaging barrier. Desiccant helps control moisture inside, while a humidity indicator card, or HIC, indicates humidity exposure. Resealing does not erase earlier exposure. A sealed-looking bag does not establish an original seal, absence of moisture damage or readiness for assembly. Avoid opening original packs unnecessarily for photographs.

Preserve useful records

• Photograph full ordering codes, lots and MSL information on box, reel or tray labels.
• Record whether the barrier bag is originally sealed or damaged and any known opening or resealing times.
• Where appropriate handling permits, record the HIC and known temperature and humidity; mark missing history as unknown.
• Split material with different lots, seal conditions or exposure records into separate list rows.

An older lot is neither automatic scrap nor automatically acceptable

TI’s shelf-life guidance stresses customer storage and handling. It does not replace the records of a particular lot or establish a promise for other manufacturers. Qualified personnel should determine any baking requirement using the device, carrier, manufacturer instructions and applicable standards. This article does not provide a universal baking recipe.

Manufacturer sources and scope

Prepared from these public sources, checked on 21 October 2026. Links explain the technology and do not imply manufacturer authorization or certification of ReclaimChips. Use the current documentation for the exact ordering code when deciding application, package or handling requirements.

• TI SPRABY1A: MSL Ratings and Reflow Profiles
• TI product shelf life

Prepare a stock list or sourcing request

List manufacturer, full ordering code, quantity, lot and condition separately. Submit surplus IC stock · Send a BOM sourcing request · Content maintenance notes.